Wafer Ring Frame
Holds the wafer from tape mounting through die pickup.
Check specificationsSemiconductor Packaging
Parts that carry the process.
Tooling that connects precision.
From magazines and wafer cassettes to bonding tools and process jigs.
Explore parts built for the conditions of your packaging process.
Professional Standard
Machine Parts
PSMP, a maker of precision parts for semiconductor equipment since 1999, supplies consumables for back-end lines. From the slots strips pass through, to the rings tape is mounted on, to the grooves wafers sit in, we control every feature to machining tolerances.
About our packaging businessProducts
All productsMagazine
Stores leadframe and substrate strips between processes and feeds them to loaders. Choose from stopper-type, cover-type and carriers.
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Wafer Ring Frame
Ring frames that hold the wafer on dicing tape. Made in 6/8/12-inch sizes to your equipment specifications.
Learn moreWafer Cassette
Stacks 8-inch and 12-inch wafers and ring frames in layers to move them between tools.
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Process Jigs & Tools
Reflow jigs, die bonder blocks, wire bonder clamps, collets and stencils.
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Magazine Carrier
A perforated carrier that holds and moves several magazines at once.
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Which process is it for?
8 featured products
12-inch Wafer Cassette
Holds ring frames and wafers in layers and feeds them to equipment.
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Stopper-type Magazine
Stoppers at the openings keep strips from sliding out.
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Cover-type Magazine
End covers keep strips from falling out in transit.
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Die Bonder Block
A block that supports the strip at the bonding position and sets its height.
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Wire Bonder Clamp
A window clamp that presses and holds the leadframe during bonding.
View productReflow Jig
Holds the substrate flat as it passes through the reflow oven.
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Flip Chip Pin Boat
Aligns the substrate with pins through flip chip bonding and reflow.
View productPSMP Consumables Across the Back-End Flow
View by processSteps where PSMP consumables go directly into the equipment Steps for storage and transfer between processes
- Wafer MountThe wafer is mounted on dicing tape.Wafer ring frame
- DicingChips are separated by blade or laser.Ring frame, ring cassette
- Die BondingChips are attached to leadframes or substrates.Magazine, die bonder block
- Wire BondingChips and leads are connected with gold wire.Magazine, wire clamp
- MoldingChips are encapsulated in resin.Magazine
- Reflow & Ball AttachSolder is melted to form joints.Reflow jig, stencil
- Test & ShippingPacked after electrical testing.Magazine carrier
26 Years of Precision Parts
Manufacturing & Quality1999PSMP founded
56Employees
KRW 18.5 billion2025 revenue
20Export customers and countries
Company-wide figures, including the automation modules and parts business.
Custom Manufacturing Starts with One Drawing
Custom manufacturing- Drawings & Samples
Send whatever you have: your drawing, a sample of the part you use now, or the equipment model name.
- Design Review
We check strip dimensions, slot pitch and loader specifications, then send an approval drawing.
- Prototype & Fit Check
Prototypes machined in-house are installed in your equipment to check for snagging and interference.
- Production & Reorders
History is tracked by approval drawing number, so the same part number is always made to the same specification.
Check Before You Buy
Downloads6 Things Needed for a Magazine Quote
Strip width, length and thickness, slot pitch and count, and equipment model.
Choosing a Compatible Wafer Ring
Start with the wafer size and the dicing equipment standard name.
Material Choice by Process
Why materials for room-temperature transfer differ from those for high-temperature processes.
Grow with Your Line
