Structure and Parts
A ring frame consists of a round inner opening, straight edges (flats) and notches for orientation. The equipment orients the ring by its flats and notches, and the tape and wafer sit within the inner diameter.
- Flat
- A straight edge on the outer perimeter. Cassette slots and equipment guides hold the ring by this edge.
- Notch
- A cutout that sets the ring's orientation. Position and shape vary by equipment standard.
- Inner diameter
- The space where tape is mounted and the wafer sits. It needs clearance beyond the wafer diameter so chips spread evenly during expanding.
- Thickness & flatness
- A warped ring causes uneven tape tension, affecting dicing alignment and pickup.
By Size
- Main applications
- 150 mm lines for power semiconductors, sensors and LEDs, and small-die processes
- Used with
- 6-inch ring cassette, ring shipping box
- What to check
- Dicing equipment standard name, notch position, tape mounter model
- Material
- Stainless steel as standard; other materials on request
- Main applications
- 200 mm logic, analog and power semiconductor back-end
- Used with
- 8-inch wafer cassette, ring cassette
- What to check
- Dicing equipment standard name, cassette slot spacing, ring thickness
- Material
- Stainless steel as standard; other materials on request
- Main applications
- 300 mm memory, logic and advanced packaging
- Used with
- 12-inch wafer cassette, frame shipping container
- What to check
- Dicing equipment standard name, automated transfer, ID engraving position
- Material
- Stainless steel as standard; other materials on request
Compatible Equipment Standards
Buyers often search by the dicing equipment's frame standard name rather than ring dimensions. Inquire with a standard name below and we will review manufacturing to that outline.
| Wafer size | Standard under review | Dimensions (across flats · inner diameter · thickness) | Status |
|---|---|---|---|
| 6-inch | DISCO DTF 2-6-1 outline | On request | Under review |
| K&S 350 series outline | On request | Under review | |
| 8-inch | DISCO DTF 2-8-1 outline | On request | Under review |
| 12-inch | DISCO DTF 2-12 outline | On request | Under review |
| Other | Customer drawing outline | Per customer drawing | Custom |
Standard names are used to describe compatible outlines. Contact us for compatibility and dimensions for specific equipment. Equipment manufacturer names are used only to describe compatible outlines.
Key Features
- Flatness control
- Flatness is measured after plate machining, and warped rings are not shipped.
- Notch & flat positions
- Notch and flat positions follow the equipment standard outline drawing.
- Edge finishing
- Edges touched by tape and operators' hands are deburred and rounded.
- ID engraving
- Part number, lot and customer-requested numbers can be engraved on the ring surface.
- Cleaned packing
- Machining oil is cleaned off and interleaf sheets are added so rings do not scratch each other.
- Reconditioning & reuse
- We recondition used rings for reuse. After checking their condition, we let you know whether it is possible and the schedule.
- RFID tags
- An RFID tag on each ring allows it to be tracked through the process.
- Reviewed with cassettes
- Ring cassette slot spacing and ring thickness are matched together to reduce transfer problems.
Ring Frames in the Process
Mounting
Dicing tape is applied to the ring frame and the back of the wafer is placed on the tape.
Dicing
The equipment takes the ring from the cassette, aligns it by flats and notches, then cuts the chips.
Cleaning & Storage
Diced rings are placed in cassettes and moved to the next tool.
Die Pickup
The tape is expanded to spread the chips, then a collet picks them up one by one.
FAQ
Can you match the outline of the rings we use now?
Send us a ring or drawing and we will measure it, create an approval drawing with the same outline, verify equipment transfer with a prototype, then start production.
Do you clean rings for reuse?
Yes, we offer a used ring reconditioning service. Send us the rings and we will check their condition, then let you know whether reconditioning is possible and the schedule.
Can I specify the engraving position?
Yes, we engrave at the position you specify as long as it does not overlap equipment sensors or tape.
Can I order ring cassettes too?
Yes. Matching ring thickness and cassette slot spacing together reduces transfer problems. See Wafer Cassette.
Ordering Information
What to Send
- Wafer size and dicing equipment standard name
- Ring drawing or a ring you use now
- Required engraving content and packing unit
Quote & Approval
- Outline, thickness, material and surface condition are specified on the approval drawing.
- A prototype is used to verify equipment transfer and tape mounting.
Reorders
- Order with the approval drawing number and quantity.
- For regular orders, delivery intervals can be set in advance.